Thermal Analysis of Paper Board Packaging with Phase Change Material: A Numerical Study
Crossref DOI link: https://doi.org/10.1007/s41783-019-00060-1
Published Online: 2019-05-06
Published Print: 2019-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mahdavi Nejad, Alireza http://orcid.org/0000-0003-4262-2062
Text and Data Mining valid from 2019-05-06
Article History
Received: 11 September 2018
Accepted: 27 April 2019
First Online: 6 May 2019