In-Process Measurement of Thickness of Cured Resin in Evanescent-Wave-Based Nano-stereolithography Using Critical Angle Reflection
Crossref DOI link: https://doi.org/10.1007/s41871-018-0013-z
Published Online: 2018-04-06
Published Print: 2018-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kong, Deqing
Michihata, Masaki
Takamasu, Kiyoshi
Takahashi, Satoru
Text and Data Mining valid from 2018-04-06
Article History
Received: 21 January 2018
Accepted: 26 February 2018
First Online: 6 April 2018