Etching Characteristics of Quartz Crystal Wafers Using Argon-Based Atmospheric Pressure CF4 Plasma Stabilized by Ethanol Addition
Crossref DOI link: https://doi.org/10.1007/s41871-019-00044-4
Published Online: 2019-07-24
Published Print: 2019-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sun, Rongyan
Yang, Xu
Watanabe, Keiichiro
Miyazaki, Shiro
Fukano, Toru
Kitada, Masanobu
Arima, Kenta
Kawai, Kentaro
Yamamura, Kazuya
Text and Data Mining valid from 2019-07-24
Version of Record valid from 2019-07-24
Article History
Received: 26 April 2019
Revised: 4 June 2019
Accepted: 15 June 2019
First Online: 24 July 2019