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Three-Dimensional Topography of Wafer Bumps Based on Microscopic Fringe Projection Profilometry

Published Online: 2026-06-09

Published Print: 2026-12

Authors

Wang, Sen

Liu, Bin https://orcid.org/0000-0003-2543-4051
Zhu, Haoxuan

Feng, Zhenzhen

Wu, Guanhao
Funding

Funding for this research was provided by:

National Key Research and Development Program of China (2024YFF0617801)

National Key Research and Development Program of China (2023YFB3407901)

Natural Science Foundation of Tianjin Municipality (25JCZDJC00300)
License Information

Text and Data Mining valid from 2026-06-09

Version of Record valid from 2026-06-09
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Article History

Received: 25 December 2025

Revised: 29 April 2026

Accepted: 1 May 2026

First Online: 9 June 2026

Declarations

:

: The authors declare that they have no conflicts of interest.

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