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Analysis of thermal stress screen for performance improvement of RF system

Crossref DOI link: https://doi.org/10.1007/s41872-020-00132-1

Published Online: 2020-05-29

Published Print: 2021-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Kumar, Vipin https://orcid.org/0000-0002-7219-4196
Funding

Funding for this research was provided by:

bharat electronics
License Information

Text and Data Mining valid from 2020-05-29

Version of Record valid from 2020-05-29
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Article History

Received: 19 February 2020

Accepted: 15 May 2020

First Online: 29 May 2020