Fundamental and innovative approaches for filler design of thermal interface materials based on epoxy resin for high power density electronics application: a retrospective
Crossref DOI link: https://doi.org/10.1007/s41939-019-00064-z
Published Online: 2019-10-26
Published Print: 2020-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Nayak, Sagar Kumar http://orcid.org/0000-0003-3539-1083
Mohanty, Smita
Nayak, Sanjay K.
Text and Data Mining valid from 2019-10-26
Version of Record valid from 2019-10-26
Article History
Received: 4 April 2019
Accepted: 29 September 2019
First Online: 26 October 2019
Compliance with ethical standards
:
: The authors declare that they have no conflict of interest.