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Thermal modeling and analysis of a power ball grid array in system-in-package technology

Published Online: 2021-09-10

Published Print: 2022-03

Authors

Bocca, Alberto https://orcid.org/0000-0002-1937-8260
Macii, Alberto https://orcid.org/0000-0002-8869-5710
Funding

Funding for this research was provided by:

Electronic Components and Systems for European Leadership (2014-2 653933)
License Information

Text and Data Mining valid from 2021-09-10

Version of Record valid from 2021-09-10
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Article History

Received: 29 March 2021

Accepted: 27 August 2021

First Online: 10 September 2021

Declarations

:

: On behalf of all authors, the corresponding author states that there is no conflict of interest.

: The model code is under license to Politecnico di Torino. It is available under request.

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