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Hydrogen bonding and π-π interaction enhanced high thermal interface design with low dielectric loss of BN/PI/epoxy for high voltage-high frequency insulating application

Crossref DOI link: https://doi.org/10.1007/s42114-023-00826-x

Published Online: 2024-02-12

Published Print: 2024-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Yao, Tong

Zhang, Chen

Zhang, Zhi

Niu, Tengteng

Yi, Qiyuan

Yang, Ying
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (No. 52077113)

Zhejiang Provincial Natural Science Foundation of China (No. LD21E070001)

State Key Laboratory of Power System and Generation Equipment (No. SKLD22Z04)
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Text and Data Mining valid from 2024-02-01

Version of Record valid from 2024-02-01
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Article History

Received: 7 August 2023

Revised: 11 December 2023

Accepted: 31 December 2023

First Online: 12 February 2024

Competing interests

: The authors declare no competing interests.

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