Crossmark

Semi-solid brazing via CoCrFeNiCux high-entropy alloy fillers: interfacial microstructure, mechanical properties, and joining mechanism of C/C-SiC composites and TZM alloy

Crossref DOI link: https://doi.org/10.1007/s42114-026-01807-6

Published Online: 2026-05-02

Published Print: 2026-08

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Zhou, Wenlong

Fu, Wei

Wang, Yanxing

Gao, Zuorui

Hu, Shengpeng

Song, Xiaoguo

Kim, Hyoung Seop

Feng, Jicai
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (52475330)

National Natural Science Foundation of China (52175307)

Natural Science Foundation of Shandong Province (ZR2023JQ021)
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Text and Data Mining valid from 2026-05-02

Version of Record valid from 2026-06-19
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Article History

Received: 22 October 2025

Revised: 27 March 2026

Accepted: 13 April 2026

First Online: 2 May 2026

Declarations

:

: The authors declare no competing interests.

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