Reduction of Leakage Current Along Polyimide Layers in Wafer Level Packaging
Crossref DOI link: https://doi.org/10.1007/s42341-019-00102-0
Published Online: 2019-02-13
Published Print: 2019-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kang, Tae Kyu
Lee, Hyung Gyoo
Funding for this research was provided by:
Chungbuk National University (Research Year 2016)
Text and Data Mining valid from 2019-02-13
Article History
Received: 9 December 2018
Revised: 22 January 2019
Accepted: 31 January 2019
First Online: 13 February 2019