Etch Mechanism of AlN Thin Film in Cl2/Ar Inductively Coupled Plasma
Crossref DOI link: https://doi.org/10.1007/s42341-022-00408-6
Published Online: 2022-08-04
Published Print: 2022-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Woo, Jong-Chang
Kim, Dong-Pyo
Kim, Gwan-Ha https://orcid.org/0000-0002-3914-2642
Funding for this research was provided by:
Ministry of Education (2018R1D1A1B07051202)
Text and Data Mining valid from 2022-08-04
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Article History
Received: 3 February 2022
Revised: 23 May 2022
Accepted: 18 June 2022
First Online: 4 August 2022