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Effect of SiO2 nanoparticle addition on growth of interfacial Ag3Sn intermetallic compound layers between lead-free solder and silver conductor

Published Online: 2021-11-14

Published Print: 2021-12

Authors

Hsiang, Hsing-I https://orcid.org/0000-0001-7058-218X
Chen, Chih-Cheng

Su, Han-Yang
Funding

Funding for this research was provided by:

Ministry of Science and Technology, Taiwan (109-3111-8-006 -001)
License Information

Text and Data Mining valid from 2021-11-14

Version of Record valid from 2021-11-14
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Article History

Received: 20 July 2021

Accepted: 2 November 2021

First Online: 14 November 2021

Declarations

:

: No conflict of interest exits in the submission of this manuscript.

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