Vacuum-Formed 3D Printed Electronics: Fabrication of Thin, Rigid and Free-Form Interactive Surfaces
Crossref DOI link: https://doi.org/10.1007/s42979-022-01174-1
Published Online: 2022-05-06
Published Print: 2022-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hong, Freddie http://orcid.org/0000-0002-6318-9723
Tendera, Luca
Myant, Connor
Boyle, David
Text and Data Mining valid from 2022-05-06
Version of Record valid from 2022-05-06
Article History
Received: 10 January 2022
Accepted: 20 April 2022
First Online: 6 May 2022
Declarations
:
: On behalf of all authors, the corresponding author states that there is no conflict of interest.