Numerical junction temperature calculation method for reliability evaluation of power semiconductors in power electronics converters
Crossref DOI link: https://doi.org/10.1007/s43236-020-00154-z
Published Online: 2020-09-23
Published Print: 2021-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Du, Xiao
Du, Xiong https://orcid.org/0000-0002-0212-1653
Zhang, Jun
Li, Gaoxian
Funding for this research was provided by:
Chongqing Science and Technology Commission (cstc2019jcyj-zdxmX0005)
Text and Data Mining valid from 2020-09-23
Version of Record valid from 2020-09-23
Article History
Received: 29 May 2020
Revised: 3 September 2020
Accepted: 4 September 2020
First Online: 23 September 2020