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Overcoming thermal-spatial constraints in server power supplies: immersion-cooled 54 V modular design achieving threefold power density enhancement and titanium class efficiency

Crossref DOI link: https://doi.org/10.1007/s43236-025-01263-3

Published Online: 2026-01-19

Published Print: 2026-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Guo, Liwen

Liu, Jing

Chen, Liang

Li, Guolong

Zhou, Wenfei

Zou, Jianxiao https://orcid.org/0000-0002-8676-8322
Funding

Funding for this research was provided by:

The National Key R&D Program of China (2021YFB2206602)
License Information

Text and Data Mining valid from 2026-01-19

Version of Record valid from 2026-01-19
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Article History

Received: 23 June 2025

Revised: 17 December 2025

Accepted: 18 December 2025

First Online: 19 January 2026

Declarations

:

: On behalf of all authors, the corresponding author states that there are no competing interests.

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