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Effect of interfacial structure on peel strength between Cu and AlN bonded with a Mg–Ti co-deposited film

Published Online: 2023-04-16

Authors

Terasaki, Nobuyuki

Kon, Naochika

Chiba, Hajime

Ohashi, Touyou

Sekino, Tohru
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Text and Data Mining valid from 2023-04-16

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Article History

Received: 15 March 2023

Accepted: 7 April 2023

First Online: 16 April 2023

Declarations

:

: The authors declare that they have no competing interests

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