Grain Boundary Engineering for Thermal Conductivity Reduction in Bulk Nanostructured Thermoelectric Materials
Crossref DOI link: https://doi.org/10.1007/978-3-030-12057-3_12
Published Online: 2019-12-18
Published Print: 2019
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wilson, Adam A.
Taylor, Patrick J.
Choi, Daniel S.
Karna, Shashi P.
Text and Data Mining valid from 2019-01-01
Chapter History
First Online: 18 December 2019