Multi-chip Modules and Multi-chip Packaging
Crossref DOI link: https://doi.org/10.1007/978-3-030-14690-0_7
Published Online: 2019-03-27
Published Print: 2019
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Božanić, Mladen
Sinha, Saurabh
Text and Data Mining valid from 2019-01-01
Chapter History
First Online: 27 March 2019