Flip-Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities
Crossref DOI link: https://doi.org/10.1007/978-3-319-90362-0_31
Published Online: 2018-09-23
Published Print: 2018
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mallik, Debendra
Mahajan, Ravi
Raravikar, Nachiket
Radhakrishnan, Kaladhar
Aygun, Kemal
Sankman, Bob
Text and Data Mining valid from 2018-01-01