Microstructure and Properties of Spray-Formed Si–30Al Alloy Used for Electronic Packaging
Crossref DOI link: https://doi.org/10.1007/978-981-13-0104-9_10
Published Online: 2018-04-18
Published Print: 2018
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Hongwei
Huang, Shuhui
Li, Zhihui
Xiong, Baiqing
Zhang, Yongan
Li, Xiwu
Yan, Hongwei
Yan, Lizhen
License valid from 2018-01-01