Microstructure and Thermal Properties of SiC/Al Composites for Electronic Packaging
Crossref DOI link: https://doi.org/10.1007/978-981-13-0104-9_88
Published Online: 2018-04-18
Published Print: 2018
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lu, Tong
Wang, Yan
Yao, Qiang
Wang, Qiong
Zhu, Yu Hong
License valid from 2018-01-01