Effect of Metallic Strip Deposition Within the Source Dielectric with Applied Double Metallic Drain for Enhanced DC/RF Behavior of Charge Plasma TFET for Low-Power IOT Applications
Crossref DOI link: https://doi.org/10.1007/978-981-13-8406-6_18
Published Online: 2019-10-27
Published Print: 2020
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Aslam, Mohd.
Sharma, Dheeraj
Soni, Deepak
Yadav, Shivendra
Text and Data Mining valid from 2019-10-27
Version of Record valid from 2019-10-27
Chapter History
First Online: 27 October 2019