Encapsulation of CNT Films on Silicon Wafer by DLC Synthesized by PECVD for Application as a Thermal Interface Material
Crossref DOI link: https://doi.org/10.1007/978-981-19-4571-7_9
Published Online: 2022-09-13
Published Print: 2023
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ankit, Krishna http://orcid.org/0000-0002-4492-4737
Evangeline, T. Gecil
Aravinda, L. S.
Kumar, N. Sharath
Sankar, Mamilla Ravi
Nagahanumaiah,
Reddy, K. Niranjan
Balashanmugam, N.
Text and Data Mining valid from 2022-09-13
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Chapter History
First Online: 13 September 2022