Microstructural, mechanical and physical properties of post heat-treated melamine-fortified urea formaldehyde-bonded particleboard
Crossref DOI link: https://doi.org/10.1007/s00107-015-0924-y
Published Online: 2015-05-03
Published Print: 2015-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, S. H.
Lum, W. C.
Zaidon, A.
Maminski, M.
Text and Data Mining valid from 2015-05-03