Influence of process parameters on the bonding performance of wood adhesive based on thermally modified soy proteins
Crossref DOI link: https://doi.org/10.1007/s00107-016-1018-1
Published Online: 2016-02-19
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Vnučec, Doroteja
Mikuljan, Marica
Kutnar, Andreja
Šernek, Milan
Goršek, Andreja
Text and Data Mining valid from 2016-02-19