Curing behavior and adhesion properties of epoxy resin blended with phenol-liquefied Cryptomeria japonica
Crossref DOI link: https://doi.org/10.1007/s00107-018-1329-5
Published Online: 2018-06-25
Published Print: 2018-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Wen-Jau
Kang, Chen-Ling
Chen, Yi-Chun http://orcid.org/0000-0002-5205-4006
Wu, Zheng-Ying
Text and Data Mining valid from 2018-06-25
Article History
Received: 13 August 2017
First Online: 25 June 2018