Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing
Crossref DOI link: https://doi.org/10.1007/s00170-014-6132-9
Published Online: 2014-07-12
Published Print: 2014-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Nguyen, N. Y.
Tian, Yebing
Zhong, Z. W.
Text and Data Mining valid from 2014-07-12