Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application
Crossref DOI link: https://doi.org/10.1007/s00170-020-05377-9
Published Online: 2020-05-22
Published Print: 2020-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gong, Yao
Cha, Kyoung Je
Park, Jang Min
Funding for this research was provided by:
Yeungnam University (2018)
Text and Data Mining valid from 2020-05-01
Version of Record valid from 2020-05-01
Article History
Received: 21 January 2020
Accepted: 28 April 2020
First Online: 22 May 2020