Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
Crossref DOI link: https://doi.org/10.1007/s00231-014-1386-1
Published Online: 2014-07-25
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Géczy, Attila
Illés, Balázs
Péter, Zsolt
Illyefalvi-Vitéz, Zsolt
Text and Data Mining valid from 2014-07-25