Evaluation of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing
Crossref DOI link: https://doi.org/10.1007/s00339-015-9531-3
Published Online: 2015-12-15
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, L.
Jin, L.
Yu, L. H.
Dong, S. T.
Chen, J.
Xu, J. H.
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