The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation
Crossref DOI link: https://doi.org/10.1007/s00339-016-0319-x
Published Online: 2016-08-09
Published Print: 2016-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Dai, Houfu
Chen, Genyu
Fang, Qihong
Yin, Jiu
Funding for this research was provided by:
the National Science and Technology Major Project of the Ministry of Science and Technology of China (2012ZX04003101)
License valid from 2016-08-09