Li, Fei
Fang, Hongbo
Wang, Dengzhun
Liu, Ruixin
Hou, Qing
Xie, Benliang http://orcid.org/0000-0002-9854-8300
Funding for this research was provided by:
National Natural Science Foundation of China (61562009)
The Open Fund Project in Semiconductor Power Device Reliability Engineering Center of Ministry of Education (ERCMEKFJJ2019-06)
Guizhou Provincial Science and Technology Projects ([2023]060)
Guizhou Provincial Science and Technology Support Plan ([2022]003)
Article History
Accepted: 1 April 2023
First Online: 22 April 2023
Declarations
:
: The authors declare that they have no conflict of interest.