Low-cost silicon wafer dicing using a craft cutter
Crossref DOI link: https://doi.org/10.1007/s00542-014-2198-4
Published Online: 2014-05-20
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fan, Yiqiang
Arevalo, Arpys
Li, Huawei
Foulds, Ian G.
License valid from 2014-05-20