Research on hot embossing process of high fill factor microlens array
Crossref DOI link: https://doi.org/10.1007/s00542-014-2352-z
Published Online: 2014-10-30
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Yiqing
Zhang, Qing
Kuang, Xinbin
Ding, Yucheng
Chen, Feng
Liu, Hongzhong
Text and Data Mining valid from 2014-10-30