Silicon–ceramic–silicon-wafercompound fabricated by using nanostructured silicon surfaces and a ceramic with adapted thermal expansion coefficient
Crossref DOI link: https://doi.org/10.1007/s00542-015-2434-6
Published Online: 2015-02-07
Published Print: 2015-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Günschmann, S.
Fischer, M.
Mannebach, H.
Steffensky, J.
Müller, J.
Text and Data Mining valid from 2015-02-07