Electrical and morphological characterization of platinum thin-films with various adhesion layers for high temperature applications
Crossref DOI link: https://doi.org/10.1007/s00542-015-2715-0
Published Online: 2015-11-14
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ababneh, A.
Al-Omari, A. N.
Dagamseh, A. M. K.
Tantawi, M.
Pauly, C.
Mücklich, F.
Feili, D.
Seidel, H.
Funding for this research was provided by:
Deutsche Forschungsgemeinschaft (SE 1425/9-1)
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