Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS
Crossref DOI link: https://doi.org/10.1007/s00542-015-2797-8
Published Online: 2015-12-29
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hofmann, Lutz
Fischer, Tobias
Werner, Thomas
Selbmann, Franz
Rennau, Michael
Ecke, Ramona
Schulz, Stefan E.
Geßner, Thomas
Funding for this research was provided by:
Deutsche Forschungsgemeinschaft (DE) (IRTG 1215)
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