Investigations of silicon wafer bonding utilizing sputtered Al and Sn films
Crossref DOI link: https://doi.org/10.1007/s00542-016-2982-4
Published Online: 2016-06-06
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhu, Zhiyuan
Yu, Min
Jin, Yufeng
Funding for this research was provided by:
National Science and Technology Major Project of China (2009ZX02038-02, 2013ZX02501)
Major State Basic Research Development Program of China (2015CB057201)
License valid from 2016-06-06