Reliability based design optimization of wire bonding in power microelectronic devices
Crossref DOI link: https://doi.org/10.1007/s00542-016-3151-5
Published Online: 2016-10-04
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Makhloufi, A.
Aoues, Y.
El Hami, A.
License valid from 2016-10-04