Hot embossing of microstructure with moving induction heating and gas-assisted pressuring
Crossref DOI link: https://doi.org/10.1007/s00542-019-04560-7
Published Online: 2019-08-06
Published Print: 2020-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kao, Ching-Chieh
Ke, Kun-Cheng
Hung, Wei-Cheng
Yang, Sen-Yeu http://orcid.org/0000-0003-1563-4914
Text and Data Mining valid from 2019-08-06
Version of Record valid from 2019-08-06
Article History
Received: 12 July 2019
Accepted: 18 July 2019
First Online: 6 August 2019