Stress analysis in new improved differential vertical comb capacitive micro accelerometer using SOI technology
Crossref DOI link: https://doi.org/10.1007/s00542-020-05155-3
Published Online: 2021-01-03
Published Print: 2021-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Dounkal, Manoj Kumar http://orcid.org/0000-0002-5864-4365
Bhan, R. K.
Kumar, Navin
Text and Data Mining valid from 2021-01-03
Version of Record valid from 2021-01-03
Article History
Received: 19 September 2020
Accepted: 27 November 2020
First Online: 3 January 2021
Compliance with ethical standards
:
: Authors declare that there is no conflict of interests.