Analysis of selective bonding processes using reactive multi-layers for system integration on LTCC based SiPs
Crossref DOI link: https://doi.org/10.1007/s00542-022-05328-2
Published Online: 2022-08-01
Published Print: 2022-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yuile, A. http://orcid.org/0000-0002-7413-0129
Schulz, A.
Müller, J.
Wiese, S.
Funding for this research was provided by:
Deutsche Forschungsgemeinschaft (Project-ID 426204742)
Universität des Saarlandes
Text and Data Mining valid from 2022-08-01
Version of Record valid from 2022-08-01
Article History
Received: 25 May 2021
Accepted: 31 May 2022
First Online: 1 August 2022