Local electrochemical deposition of Ni into vertical vias in Si/SiO2 substrate
Crossref DOI link: https://doi.org/10.1007/s00542-022-05335-3
Published Online: 2022-07-15
Published Print: 2022-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Vorobjova, A. I.
Labunov, V. A.
Outkina, E. A.
Khodin, A. A. http://orcid.org/0000-0002-0851-3383
Text and Data Mining valid from 2022-07-15
Version of Record valid from 2022-07-15
Article History
Received: 26 August 2021
Accepted: 16 June 2022
First Online: 15 July 2022
Declarations
:
: Not applicable.