Analysis of dynamic stress intensity factors for interfacial crack near shallow circular inclusion in bi-material half-space to SH wave
Crossref DOI link: https://doi.org/10.1007/s00707-016-1678-2
Published Online: 2016-07-21
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Jie http://orcid.org/0000-0003-1827-9508
Qi, Hui
Funding for this research was provided by:
The Training Foundation Programs for Young Teachers of Colleges and University in Shanghai (ZZSDJ13009)
License valid from 2016-07-21