Thermal Expansion Behavior of Poly(amide-imide) Films with Ultrahigh Tensile Strength and Ultralow CTE
Crossref DOI link: https://doi.org/10.1007/s10118-020-2366-1
Published Online: 2019-12-13
Published Print: 2020-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Bai, Lan
Zhai, Lei
He, Min-Hui
Wang, Chang-Ou
Mo, Song
Fan, Lin
Text and Data Mining valid from 2019-12-13
Version of Record valid from 2019-12-13
Article History
Received: 12 September 2019
Accepted: 29 October 2019
First Online: 13 December 2019