Thermodynamic analysis of metals recycling out of waste printed circuit board through secondary copper smelting
Crossref DOI link: https://doi.org/10.1007/s10163-017-0590-8
Published Online: 2017-02-24
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ghodrat, Maryam
Rhamdhani, Muhammad Akbar
Khaliq, Abdul
Brooks, Geoffrey
Samali, Bijan
License valid from 2017-02-24