An energy-efficient multi-level RF-interconnect for global network-on-chip communication
Crossref DOI link: https://doi.org/10.1007/s10470-019-01459-1
Published Online: 2019-05-04
Published Print: 2020-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jalalifar, Majid
Byun, Gyung-Su
Funding for this research was provided by:
Inha University (INHA-00000)
Text and Data Mining valid from 2019-05-04
Article History
Received: 4 November 2017
Revised: 15 January 2019
Accepted: 26 April 2019
First Online: 4 May 2019