Thermally-aware circuit model and performance analysis of MLGNR for nano-interconnect application
Crossref DOI link: https://doi.org/10.1007/s10470-024-02254-3
Published Online: 2024-02-21
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sharma, Himanshu
Sandha, Karmjit Singh
Text and Data Mining valid from 2024-02-21
Version of Record valid from 2024-02-21
Article History
Received: 28 December 2022
Revised: 25 December 2023
Accepted: 6 January 2024
First Online: 21 February 2024
Declarations
:
: The authors declare no conflict of interest.