Electrodeposition of copper thin films from 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide
Crossref DOI link: https://doi.org/10.1007/s10800-014-0773-0
Published Online: 2014-10-18
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Tomin
Vilar, Rui
Eugénio, Sónia
Grondin, Joseph
Danten, Yann
Text and Data Mining valid from 2014-10-18