Cu–Ni alloy electrodeposition on microstructured surfaces
Crossref DOI link: https://doi.org/10.1007/s10853-014-8598-0
Published Online: 2014-09-18
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Jae Min
Ko, Jong Soo
Text and Data Mining valid from 2014-09-18